Process Analysis:

• Micro-Area and Surface Analysis (XPS, AES, TOF-SIMS)
• Determination of Material Parameters (Electrical, Mechanical, Thermal, Optical Properties)
• Optical Measuring Methods for Micro Technologies (e.g. White Light Interferometry, Laser Scanning Microscopy)
• Image Processing for Quality Assurance

Function- and Reliability-Tests:

• Examination of Assembly and Packaging Techniques (e.g. Pull and Shear Tests)
• Measuring Methods for Device Characterisation (e.g. Microwave Measurements, up to 110 GHz)
• Investigation of Reliability and Long-Term Stability
• Development of Test and Calibration Procedures

Failure Analysis:

• Failure Analysis for Micro Systems and Components
• Defect Analysis and Expert Opinions in the Field of Surface Technologies